Sponsor
U.S. Department of State, Bureau of Economic and Business Affairs
Summary
The International Technology Security and Innovation (ITSI) Fund, created by the CHIPS Act of 2022, supports the development and adoption of secure semiconductors and semiconductor supply chains with the goal to make the global semiconductor supply chain more resilient, diversified, and secure. This funding opportunity will help expand international semiconductor assembly, testing, and packaging capacity in Vietnam. Proposed work should align with Vietnam’s National Semiconductor Strategy goals and demonstrate collaboration with the Vietnamese government. This solicitation includes two (2) categories under which applicants may submit: (1) Workforce Development and (2) Policy and Regulatory Reform. This application process includes a Statement of Interest (SOI), followed by an invitation to submit a full proposal.
For more information, view the full FY24 EB ITSI Programs Vietnam – Statement of Interest.
Award
$1,000,000 to $5,000,000 for up to three years.
Limited Submission Requirements and Timeline
Organizations may submit no more than two (2) SOIs and only one (1) SOI per category.
Only SOIs approved by the Division of Research and Economic Development may be submitted to this program. For such approval, Principal Investigators must first submit a Notice of Interest to limitedsubmissions@boisestate.edu by 4 pm on July 31, 2024. Include the category you would like to submit to.
**If necessary, a further white paper round may be required**
Key Submission Dates
- July 31, 2024 by 4 pm – Notice of Interest due to limitedsubmissions@boisestate.edu
- August 2, 2024 – Anticipated date applicant will be notified of approval to advance toward SOI submission
- August 12, 2024 – SOI due to OSP
- August 16, 2024 – SOI due to sponsor
NOTE: Please send all inquiries and submissions for Limited Submission opportunities to limitedsubmissions@boisestate.edu.