The Institute for Microelectronics Education and Research hosted the Memorandum of Understanding signing event with delegates from Hiroshima University as a part of the University Partnership for Workforce Advancement and Research and Development in semiconductors (UPWARDS) program on June 26, 2024.
As a part of the UPWARDS partnership, one of the goals is to share experiences, technology, and curriculum within the semiconductor industry as they are the backbone of modern electronics.
This MOU signing ceremony serves to formalize, publicize, and celebrate the partnership between Boise State and Hiroshima University as a part of the UPWARDS program in order to set the stage for future collaboration and progress.
The visit commenced with a tour of various College of Engineering research facilities as guided by Eric Jankowski, associate professor and director of Micron School of Materials Science and Engineering. The delegates from Hiroshima University were able to see the level of research being done in a variety of fields within the Micron School of Materials Science and Engineering.
The MER Institute would like to thank all the participating departments, faculty members, and staff members who shared their time and talents to make this a successful event.