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Hardware-Software Co-Design of Sustainable AI: Neuromorphic Computing and Beyond
Ruch Engineering Building, Room 103 1375 University Drive, Boise
Next-Generation Multi-Modal Biomedical Sensors and Systems for Diagnosis, Intervention, and Rehabilitation
Ruch Engineering Building, Room 103 1375 University Drive, BoiseWeek of Events
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Faculty Candidate Ankit Mittal Presents
Faculty Candidate Ankit Mittal Presents
Join us at 10:55 AM in RUCH 103 for a presentation from ECE Faculty Candidate Ankit Mittal.
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Hardware-Software Co-Design of Sustainable AI: Neuromorphic Computing and Beyond
Hardware-Software Co-Design of Sustainable AI: Neuromorphic Computing and Beyond
Join us at 10 AM in RUCH 103 for a presentation from ECE Faculty Candidate Sangmin Yoo.
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Next-Generation Multi-Modal Biomedical Sensors and Systems for Diagnosis, Intervention, and Rehabilitation
Next-Generation Multi-Modal Biomedical Sensors and Systems for Diagnosis, Intervention, and Rehabilitation
Join us at 11 AM in RUCH 103 for a presentation from ECE Faculty Candidate Manob Saikia.
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Advanced Packaging Technologies for Semiconductor Devices
Advanced Packaging Technologies for Semiconductor Devices
Join us at 10:30 AM in MEC 114 for a presentation from Kunal Parekh and Derek Nesbitt, engineers on the Advanced Packaging Technology Development team at Micron.Â