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Advanced Packaging Technologies for Semiconductor Devices

Ruch Engineering Building, Room 103 1375 University Drive, Boise, ID, United States

Join us at 10:30 AM in MEC 114 for a presentation from Kunal Parekh and Derek Nesbitt, engineers on the Advanced Packaging Technology Development team at Micron. 

Graduate Defense: Daniel Botello

Location TBD 1910 University Dr., Boise, ID, United States

Thesis Information Title: Verifying The Taxonomic Validity And Resolving The Subspecific Boundaries Of The Lomatium...

Graduate Defense: Daniel Botello

Location TBD 1910 University Dr., Boise, ID, United States

Thesis Information Title: Verifying The Taxonomic Validity And Resolving The Subspecific Boundaries Of The Lomatium...

Blender Basics

MakerLab (1st Floor of Albertsons Library)

Ready to bring your creativity to life in the digital world? Join us for a...

Senior Recital: Archie Flores, trombone

Morrison Center – Recital Hall 2201 W Cesar Chavez Lane, Boise, ID, United States

Thursday, February 15, 2024 7:30 p.m. – 8:30 p.m. Morrison Center Recital Hall, C200 Archie...