COEN Staff Directory

Dr. Lighty comes to Boise State from the University of Utah and the National Science Foundation, where she has been a division director since October 2013. A professor at the University of Utah for 29 years, Dr. Lighty was chair of the Department of Chemical Engineering, director of the Institute for Combustion and Energy Studies, and associate dean for academics in the College of Engineering. She received the SWE Distinguished Engineering Educator Award, the Utah Engineering Educator of the Year from the Utah Engineering Council, and the University’s Linda Amos Award for Distinguished Service to Women. She earned her Ph.D. in chemical engineering from the same university in 1988. Dr. Lighty’s research focuses on combustion-generated fine particulate matter formation, soot oxidation, and carbon capture technologies. She is a fellow of the American Institute of Chemical Engineers and has served on several national boards and committees focusing on the environmental aspects of combustion. As the director of the NSF’s Division of Chemical, Bioengineering, Environmental and Transport Systems, she led 16 programs and was a key architect of the cross-NSF initiative, Innovations at the Nexus of Food, Energy and Water Systems, serving as co-lead since its launch in 2015.

• Ph.D. in Chemical Engineering – University of Utah
• B.S. in Chemical Engineering – University of Utah

Find publications by JoAnn Slama Lighty on Google Scholar

My research has focused on combustion and gasification of fuels and the resulting pollutants from these systems. My current work is on carbon capture through oxygen burning, namely Chemical Looping, and black carbon emissions.

• fine particulate matter
• carbon capture

Peter Miranda is the Director of the Idaho Microfabrication Laboratory for the College of Engineering at Boise State University. Peter received his master’s degree in mechanical engineering from Boise State University in 2004, and his bachelor’s degree from the University of Idaho in mechanical engineering in 1996. Prior to joining Boise State, Peter worked as a manufacturing engineer for Jabil Circuit, a contract manufacturer of printed circuit boards, where he helped refine many of the manufacturing processes at local and distant plant sites using experimental methods.

Peter joined Boise State University in the spring of 2005 as a research engineer and made valuable contributions to the Defense Advanced Research Projects Agency (DARPA) project in the area of chemical-mechanical planarization (CMP) of copper through-wafer interconnects (TWIs). In his current role, Peter is responsible for the operations management of the Idaho Microfabrication Laboratory.

• “Thermo-mechanical characterization of copper through-wafer interconnects” Miranda, P.A., Moll, A.J. 2006 Proceedings. 56th Electronic Components & Technology Conference, p 5 pp.
• “Chemical mechanical planarization for Cu through-wafer interconnects” Miranda, P.A., Imonigie, J.A. Moll, A.J.  Journal of the Electrochemical Society, v 153, n 3, 2006, p G211-G217.
• “Novel slurry solutions for thick Cu CMP” Miranda, P.A. Imonigie, J.A. Erbe, A.L.Moll, A.J. 2005 IEEE Workshop on Microelectronics and Electron Devices, p 92-94.
• “Interaction effects of slurry chemistry on chemical mechanical planarization of electroplated copper” Miranda, P.A. Imonigie, J.A. Moll, A.J. IEEE Workshop on Microelectronics and Electron Devices, 2004 IEEE Workshop on Microelectronics and Electron Devices, p 85-88.

Pete’s research interests include the area of advanced fabrication and packaging techniques for 3D microelectronic devices.

Idaho Microfabrication Laboratory (IML)