Katelyn Wada

Bio

Dr. Katelyn (Kati) Wada is a Lecturer in the Department of Mechanical and Biomedical Engineering (MBE) at Boise State University. She previously received her B.S. in Physics from Boise State University in Fall 2018. Following graduation, she was an adjunct instructor for the physics department. Shortly thereafter, Kati joined the Advanced Nanomaterials and Manufacturing Laboratory to pursue her Doctorate in Materials Science and Engineering working with the Idaho National Laboratory and the DOE’s Advanced Sensors and Instrumentation program to develop thermal conductivity measurements for extreme environments. Dr. Wada successfully defended her Ph.D. in Summer 2023 and held an adjunct position teaching Thermal/Fluids II in the MBE Department in Fall 2023 while she continued to work with the Advanced Nanomaterials and Manufacturing Laboratory to develop novel manufacturing techniques for thermal conductivity measurement platforms and maintained a position leading the thermal and electrical transport lab. Dr. Wada accepted a Lecture position in the MBE department starting Spring 2024.

Courses Taught

• PHYS 212L Physics II with Calculus Lab
• ME 321 Thermal/Fluids I
• ME 323 Thermal/Fluids II
• ME 426/526 Renewable Energy Systems

Education

• Boise State University, Ph.D. in Materials Science and Engineering, 2023
• Boise State University, B.S. in Physics, 2018

In preparation, submitted, and in review: *

1. Eixenberger, J. E., Anders, C. B., Wada, K., Reddy, K. M., Brown, R. J., Moreno-Ramirez, J., Weltner, A. E., Karthik, C., Tenne, D. A., Fologea, D., & Wingett, D. G. (2019). Defect Engineering of ZnO Nanoparticles for Bioimaging Applications. ACS Applied Materials and Interfaces, 11(28), 24933–24944. https://doi.org/10.1021/acsami.9b01582
2. *Josh E. Eixenberger, Catherine B. Anders, Rebecca Hermann, Katelyn Wada, Kongara M. Reddy, Raquel J. Brown, Daniel Fologea, Denise G. Wingett, “On Demand Release of Encapsulated ZnO Nanoparticles and Chemotherapeutics for Targeted Drug Delivery Applications”, ACS nano (Under review)
3. K. Wada, A. Fleming, and D. Estrada, “Novel Thermal Conductivity Measurement Technique Utilizing a Transient Multilayer Analytical Model of a Line Heat Source Probe for Extreme Environments,” in Energy Technology 2023, Springer, 2023. doi: 10.1007/978-3-031-22638-0_13.
4. K. Wada, A. Fleming, J. Eixenberger, B. J. Jaques, and D. Estrada, “Transient multilayer analytical model of a line heat source probe for in-pile thermal conductivity measurements,” International Journal of Thermal Sciences, vol. 188, p. 108241, 2023, doi: 10.1016/j.ijthermalsci.2023.108241.
5. Katelyn Wada, Austin Fleming, Joshua Eixenberger, Brian Jaques, David Estrada, “Analytical Models for In-Pile Thermal Conductivity Determination Utilizing Line Heat Source Probes”, NPIC HMIT
6. *Katelyn Wada, Austin Fleming, Brian J. Jaques, David Estrada, “High Temperature Validation of a Line Heat Source Technique for In-Pile Thermal Conductivity Determination”, International Journal of Heat and Mass Transfer, 2023. (Submitted)
7. *Katelyn Wada, Scott Riley, Brian J. Jaques, David Estrada, “Methods for Temperature and Thermal Conductivity Measurements in Extreme Environments” (In-progress)
8. Katelyn Wada, Joshua Eixenberger, Dallin Stout, Todd Otanicar, Brian J. Jaques, David Estrada, “Analysis of near-wall pebble bed thermal conductivity”, ACS Omega, 2023, doi:10.1021/acsomega.3c08202.
9. *Nb/Mo Printed Thermocouple Device for In-Pile Temperature Detection (In-progress)
10. Tony Valayil Varghese, Josh Eixenberger, Fereshteh Rajabi-Kouchi, Maryna Lazouskaya, Cadre Francis, Hailey Burgoyne, Katelyn Wada, Harish Subbaraman, David Estrada, “Multi-Jet gold nanoparticle inks for additive manufacturing of printed and wearable electronics”, ACS materials AU, 2023, doi:10.1021/acsmaterialsau.3c00058.
11. *Mone’t Sawyer, Olivia Nielson, Hailey Burgoyne, Katelyn Wada, Michael Eppel, Raquel Montenegro-Brown, Josh Eixenberger, David Estrada, “Conductive graphene foam bioscaffolds facilitate direct electrical stimulus for cartilage tissue engineering”, TMS 2024 (Abstract submitted)