Personnel

Bio

Peter Miranda is the Director of the Idaho Microfabrication Laboratory for the College of Engineering at Boise State University. Peter received his master’s degree in mechanical engineering from Boise State University in 2004, and his bachelor’s degree from the University of Idaho in mechanical engineering in 1996. Prior to joining Boise State, Peter worked as a manufacturing engineer for Jabil Circuit, a contract manufacturer of printed circuit boards, where he helped refine many of the manufacturing processes at local and distant plant sites using experimental methods.

Peter joined Boise State University in the spring of 2005 as a research engineer and made valuable contributions to the Defense Advanced Research Projects Agency (DARPA) project in the area of chemical-mechanical planarization (CMP) of copper through-wafer interconnects (TWIs). In his current role, Peter is responsible for the operations management of the Idaho Microfabrication Laboratory.

Publications

• “Thermo-mechanical characterization of copper through-wafer interconnects” Miranda, P.A., Moll, A.J. 2006 Proceedings. 56th Electronic Components & Technology Conference, p 5 pp.
• “Chemical mechanical planarization for Cu through-wafer interconnects” Miranda, P.A., Imonigie, J.A. Moll, A.J.  Journal of the Electrochemical Society, v 153, n 3, 2006, p G211-G217.
• “Novel slurry solutions for thick Cu CMP” Miranda, P.A. Imonigie, J.A. Erbe, A.L.Moll, A.J. 2005 IEEE Workshop on Microelectronics and Electron Devices, p 92-94.
• “Interaction effects of slurry chemistry on chemical mechanical planarization of electroplated copper” Miranda, P.A. Imonigie, J.A. Moll, A.J. IEEE Workshop on Microelectronics and Electron Devices, 2004 IEEE Workshop on Microelectronics and Electron Devices, p 85-88.

Research

Pete’s research interests include the area of advanced fabrication and packaging techniques for 3D microelectronic devices.

Research Website

Idaho Microfabrication Laboratory (IML)