Equipment Resources
Additive Manufacturing
Characterization and Metrology
Physical Vapor Deposition
Plasma Etch
Surface Chemistry/Wet Processing
Photolithography
- Quintel Q-4000 Contact Aligner
- OAI 5000 Contact Aligner
- CEE Model 200X-F Spin Coater (Integrated with JST Solvent Processing Station)
Thermal Processing
- MiniBrute MB-80 Thermal Oxidation/Diffusion Furnace
- Rapid Thermal Processing System
- Blue Electric SV-57A Oven
- Programmable Hot Plates (Integrated With Each of Three JST Chemical Processing Stations)
- Systems Integration 7200-1453 Hot Plate
Back-End Processing
- WestBond Model 7476 Wire Bonding System
- K&S Model 4526 Wedge Bonding System
- ADT982-6 Wafer Dicer